The 7th China semiconductor industry association semiconductor discrete device annual meeting was held form July 21 to July 24 ,2013 in Dalian, China. The meeting sponsored by the China semiconductor industry association.
    TYSiC attended the meeting, communicating with other companies and presenting the latest research results and products of the company, to make more companies and society to deepen understanding of SiC epitaxial wafer and the device.

The meeting